Heat dissipation structure for electronic device and electronic device

ABSTRACT

An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a national stage of International Application No.PCT/CN2017/103830, filed on Sep. 27, 2017, which claims priority toChinese Patent Application No. 201621093416.3, filed on Sep. 28, 2016.Both of the aforementioned applications are hereby incorporated byreference in their entireties.

TECHNICAL FIELD

Embodiments of this application relate to device dissipationtechnologies, and in particular, to a heat dissipation structure for anelectronic device and an electronic device.

BACKGROUND

With development of electronic communications technologies and userequirements of users on electronic devices, the electronic devicesimplement a growing quantity of functions. Consequently, powerconsumption of the electronic device is increasingly high, that is, moreheat is generated.

A user may usually obtain a desired sound effect by increasing a volumeof the electronic device. However, when the volume of the electronicdevice is increased, power of a speaker box of the electronic device isincreased. Consequently, the speaker box generates more heat. Inaddition, heat of another element adjacent to the speaker box inside theelectronic device is conducted to the speaker box. Consequently, thespeaker box also generates more heat.

Currently, the speaker box in the electronic device has a poor heatconduction effect. Consequently, heat dissipation of the speaker box ispoor. In this case, when the speaker box generates heat, the heat cannotbe effectively conducted for dissipation. Consequently, a partial regionof the speaker box in the electronic device overheats.

SUMMARY

Embodiments of this application provide a heat dissipation structure foran electronic device and an electronic device, to avoid local hightemperature of the electronic device.

An embodiment of this application provides a heat dissipation structurefor an electronic device, including a rear cover, a mainboard, abattery, an antenna panel, a speaker box, and a middle frame, where aheat dissipating layer is disposed on the rear cover, a first shieldcover and a second shield cover are disposed on the mainboard, and thespeaker box is disposed on a surface of the antenna panel, a firstregion of the heat dissipating layer is in contact with the first shieldcover of the mainboard, and the second shield cover of the mainboard isin contact with a first region of the middle frame, a second region ofthe heat dissipating layer is in contact with a surface of the battery,and another surface of the battery that is distant from the heatdissipating layer is in contact with a second region of the middleframe, and a third region of the heat dissipating layer is in contactwith a surface of the speaker box that is distant from the antennapanel, and another surface of the antenna panel that is distant from thespeaker box is in contact with a third region of the middle frame.

In the heat dissipation structure for an electronic device, because theheat dissipating layer disposed on the rear cover may be in contact withthe mainboard and the battery, and may also be in contact with thespeaker box, the heat dissipation structure for an electronic deviceimplements heat dissipation of the mainboard and the battery, and mayfurther implement heat dissipation of a region of the speaker box, toeffectively avoid local high temperature, and implement equalized heatdissipation of the electronic device, thereby improving user experience.

Optionally, the third region of the heat dissipating layer is in contactwith a partial or entire region of the surface of the speaker box thatis distant from the antenna panel.

Optionally, the third region of the heat dissipating layer is in contactwith the surface of the speaker box that is distant from the antennapanel through adhesion, and an adhesive used in the adhesion is anadhesive for heat conduction.

Optionally, the third region of the heat dissipating layer is in contactwith the surface of the speaker box that is distant from the antennapanel through welding.

Because a material used the adhesion or the welding is a thermallyconductive material, when the heat dissipating layer is in contact withthe speaker box through the adhesion or the welding, thermalconductivity between the heat dissipating layer and the speaker box maybe improved, and heat transfer efficiency may be increased.

Optionally, the first region of the heat dissipating layer may also bein contact with the first shield cover of the mainboard in throughadhesion or welding, and the second shield cover of the mainboard mayalso be in contact with the first region of the middle frame in throughadhesion or welding. An adhesive used in the adhesion may also be anadhesive for heat conduction, and a flux used in the welding is athermally conductive flux.

Because a material used in the adhesion or in the welding is a thermallyconductive material, when the heat dissipating layer is in contact withthe first shield cover through the adhesion or the welding, thermalconductivity between the heat dissipating layer and the first shieldcover may be improved, thereby improving thermal conductivity betweenthe mainboard and the heat dissipating layer, and increasing heattransfer efficiency.

Optionally, the second region of the heat dissipating layer may also bein contact with the battery through adhesion or welding, and the anothersurface of the battery that is distant from the heat dissipating layermay also be in contact with the second region of middle frame throughadhesion or welding. An adhesive used in the adhesion may also be anadhesive for heat conduction, and a flux used in the welding is athermally conductive flux.

Because a material used in the adhesion or in the welding is a thermallyconductive material, when the heat dissipating layer is in contact withthe battery through the adhesion or the welding, thermal conductivitybetween the heat dissipating layer and the battery may be improved, andheat transfer efficiency may be increased.

Optionally, a material of the speaker box is a thermally conductivematerial, and the thermally conductive material includes any one of thefollowing, including thermally conductive plastic, ceramic, and metal.

For the speaker box formed by a thermally conductive material, heatgenerated by an element inside the speaker box may be better conductedto a surface of the speaker box, for effective dissipation.

Optionally, a dielectric constant of the thermally conductive materialis less than or equal to 8, a loss angle of the thermally conductivematerial is less than or equal to 0.01, and a coefficient of thermalconductivity of the thermally conductive material is greater than orequal to 1 W/(m*K).

The dielectric constant of the thermally conductive material of thespeaker box is less than or equal to 8, so that heat generated by anelement inside the speaker box can be better conducted to a surface ofthe speaker box, to effectively avoid electrical interference from theelement inside the speaker box. The coefficient of thermal conductivityof the thermally conductive material of the speaker box is greater thanor equal to 1 W/(m*K), so that heat conductivity between the elementinside the speaker box and the speaker box is improved, and heattransfer efficiency is increased.

Optionally, a charger is further disposed on the antenna panel.

Heat generated by the charger in a charging process may be transferredto the speaker box by using the antenna panel, and then is dissipated byusing the heat dissipating layer in contact with the speaker box. Heatdissipation of the region of the speaker box in a charging scenario mayalso be implemented, to avoid local high temperature of an electronicdevice, and improve user experience.

Optionally, the heat dissipating layer includes a heat equalizing layer,and the heat equalizing layer is in contact with the mainboard, thebattery, and the antenna panel.

The heat equalizing layer can evenly dissipate heat absorbed from themainboard, the battery, and the speaker box, to effectively avoid localheat dissipation of the electronic device.

Optionally, a coefficient of thermal conductivity of the heat equalizinglayer is greater than or equal to 250 W/(m*K).

Optionally, the heat dissipating layer further includes a heataccumulating layer and a heat insulation layer, the heat insulationlayer is in contact with the rear cover, and the heat accumulating layeris located between the heat insulation layer and the heat equalizinglayer.

The heat accumulating layer can absorb heat from the heat equalizinglayer by using a phase change, and stores heat energy, to alleviatetemperature rise of the rear cover of the electronic device. The heatinsulation layer can stop heat from being directly transferred to therear cover, to alleviate temperature rise of the rear cover of theelectronic device.

Optionally, a specific heat capacity of the heat accumulating layer isgreater than or equal to 100 J/(g*K), and a coefficient of thermalconductivity of the heat insulation layer is less than or equal to 0.5W/(m*K).

Optionally, in a direction perpendicular to the heat dissipating layer,the middle frame is further disposed with a first separating piece and asecond separating piece, the first separating piece is configured toseparate the mainboard from the battery along a longitudinal direction,the second separating piece is configured to separate the battery fromthe antenna panel along the longitudinal direction, and the longitudinaldirection is a direction perpendicular to the heat dissipating layer.

Optionally, thermally conductive foam is further disposed between theantenna panel and the second separating piece.

The thermally conductive foam disposed between the antenna panel and thesecond separating piece may implement a heat conduction pathsequentially including the battery, the second separating piece, theantenna panel, and the speaker box, to implement heat dissipation on theheat conduction path, and effectively avoid local heat generation of theelectronic device.

An embodiment of this application further provides an electronic device,including the heat dissipation structure according to any one of theforegoing descriptions.

The heat dissipation structure for an electronic device and theelectronic device are provided in the embodiments of this application.The heat dissipation structure for an electronic device may include therear cover, the mainboard, the battery, the antenna panel, the speakerbox, and the middle frame. The heat dissipating layer is disposed on therear cover. The first shield cover and the second shield cover aredisposed on the mainboard. The speaker box is disposed on the surface ofthe antenna panel. The first region of the heat dissipating layer is incontact with the first shield cover of the mainboard, and the secondshield cover of the mainboard is in contact with the first region of themiddle frame. The second region of the heat dissipating layer is incontact with the surface of the battery, and the another surface of thebattery that is distant from the heat dissipating layer is in contactwith the second region of the middle frame. The third region of the heatdissipating layer is in contact with the surface of the speaker box thatis distant from the antenna panel, and the another surface of theantenna panel that is distant from the speaker box is in contact withthe third region of the middle frame. In the heat dissipation structurefor an electronic device, because the heat dissipating layer disposed onthe rear cover may be in contact with the mainboard and the battery, andmay also be in contact with the speaker box, the heat dissipationstructure for an electronic device implements heat dissipation of themainboard and the battery, and may further implement heat dissipation ofthe region of the speaker box, to effectively avoid local hightemperature, and implement equalized heat dissipation of the electronicdevice, thereby improving user experience.

BRIEF DESCRIPTION OF THE DRAWINGS

To describe technical solutions in embodiments of this application or inthe prior art more clearly, the following briefly describes theaccompanying drawings required for describing the embodiments or theprior art. Apparently, the accompanying drawings in the followingdescription show some embodiments of this application, and persons ofordinary skill in the art may still derive other drawings from theseaccompanying drawings without creative efforts.

FIG. 1 is a schematic diagram of a heat dissipation structure for anelectronic device according to Embodiment 1 of this application;

FIG. 2 is a schematic diagram of a heat dissipation structure for anelectronic device according to Embodiment 2 of this application;

FIG. 3 is a schematic diagram of another heat dissipation structure foran electronic device according to Embodiment 2 of this application; and

FIG. 4 is a schematic structural diagram of an electronic deviceaccording to Embodiment 3 of this application.

REFERENCE NUMERALS

-   -   11: Rear cover;    -   12: Mainboard;    -   13: Battery;    -   14: Antenna panel;    -   15: Speaker box;    -   16: Middle frame;    -   161: First separating piece;    -   162: Second separating piece;    -   17: Heat dissipating layer;    -   171: Heat equalizing layer;    -   172: Heat accumulating layer;    -   173: Insulation layer;    -   18: First shield cover;    -   19: Second shield cover;    -   20: Thermally conductive foam;    -   40: Electronic device;    -   41: Heat dissipation structure.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

To make the objectives, technical solutions, and advantages of theembodiments of this application clearer, the following clearly andcompletely describes the technical solutions in the embodiments of thisapplication with reference to the accompanying drawings in theembodiments of this application. Apparently, the described embodimentsare some but not all of the embodiments of this application. All otherembodiments obtained by persons of ordinary skill in the art based onthe embodiments of this application without creative efforts shall fallwithin the protection scope of this application.

Embodiment 1 of this application provides a heat dissipation structurefor an electronic device. The heat dissipation structure may be locatedin an electronic device. For example, the electronic device may be anelectronic device such as a mobile phone, a notebook computer, or atablet computer. FIG. 1 is a schematic diagram of the heat dissipationstructure for an electronic device according to Embodiment 1 of thisapplication. As shown in FIG. 1, the heat dissipation structure for anelectronic device may include a rear cover 11, a mainboard 12, a battery13, an antenna panel 14, a speaker box 15, and a middle frame 16. A heatdissipating layer 17 is disposed on the rear cover 11. A first shieldcover 18 and a second shield cover 19 are disposed on the mainboard 12.The speaker box 15 is disposed on a surface of the antenna panel 14.

A first region of the heat dissipating layer 17 is in contact with thefirst shield cover 18 of the mainboard 12, and the second shield cover19 of the mainboard 12 is in contact with a first region of the middleframe 16.

A second region of the heat dissipating layer 17 is in contact with asurface of the battery 13, and the other surface of the battery 13 thatis distant from the heat dissipating layer 17 is in contact with asecond region of the middle frame 16.

A third region of the heat dissipating layer 17 is in contact with asurface of the speaker box 15 that is distant from the antenna panel 14,and the other surface of the antenna panel 14 that is distant from thespeaker box 15 is in contact with a third region of the middle frame 16.

Specifically, the mainboard 12 and the antenna panel 14 each may be aprinted circuit board (Printed Circuit Board, PCB for short). An elementsuch as a processor may be integrated on the mainboard 12, and anantenna element such as wiring of an antenna array may be integrated onthe antenna panel 14. For example, the antenna element may include atleast one antenna of a mobile communications antenna, a WirelessFidelity (Wireless-Fidelity, Wi-Fi for short) antenna, a GlobalPositioning System (Global Positioning System, GPS for short) antenna, aBluetooth (Bluetooth) antenna, a Near Field Communication (Near FieldCommunication, NFC for short) antenna, a wireless charging (WirelessCharge) antenna, and the like. The mobile communications antenna may beat least one of a 2nd generation (2nd Generation, 2G for short)communications antenna, a 3rd generation (3rd Generation, 3G for short)communications antenna, a 4th generation (4th Generation, 3G for short)communications antenna, a 5th generation (5th Generation, 5G for short)communications antenna, and an antenna using a subsequently evolvedcommunication technology. For example, the antenna element may be in arange from 450 MHz to 5 GHz. Usually, the mainboard 12 may also bereferred to as a large board, and the corresponding antenna panel 14 maybe referred to as a small board.

The mainboard 12 may be disposed with a plurality of shield covers.Interference from a neighboring element to an element on the mainboard12 may be isolated by using a shield cover. That is, the shield cover isconfigured to shield and protect electrical characteristics of theelement on the mainboard 12. The first shield cover 18 may refer to ashield cover that is in the plurality of shield covers and that is incontact with the heat dissipating layer 17, and the second shield cover19 may refer to a shield cover that is in the plurality of shield coversand that is in contact with the middle frame 16. That is, the firstshield cover 18 and the second shield cover 19 each refer to shieldcovers of one class, and each may include at least one shield cover. Itshould be noted that FIG. 1 is described by using only a case in whichthe first shield cover 18 and the second shield cover 19 each includeone shield cover. This application is not limited thereto.

The speaker box 15 may include a sound element such as a speaker(Speaker) and a receiver (Receiver). The speaker and the receiver may bedisposed on the antenna panel 14. The heat dissipating layer 17 may be athermally conductive layer formed by a thermally conductive materialwhose coefficient of thermal conductivity is greater than a presetfrequency, or may be a composite thermally conductive layer formed by athermally conductive material and another material. This application isnot limited thereto.

The first region of the heat dissipating layer 17 may be in contact withthe first shield cover 18 of the mainboard 12, so that heat of themainboard 12 is transferred to the heat dissipating layer 17 by usingthe first shield cover 18, to dissipate heat of a region of themainboard 12. The second shield cover 19 of the mainboard 12 is incontact with the first region of the middle frame 16, so that themainboard 12 is secured to the middle frame 16, to enable the mainboard12 to be stable in the electronic device, and effectively ensureperformance of the element on the mainboard 12.

The second region of the heat dissipating layer 17 is in contact withthe surface of the battery 13, so that heat of the battery 13 may betransferred to the heat dissipating layer 17, to implement heatdissipation of a region of the battery 13. The other surface of thebattery 13 that is distant from the heat dissipating layer 17 is also incontact with the second region of the middle frame 16, so that thebattery 13 is secured to the middle frame 16, to enable the battery 13to be stable in the electronic device.

The third region of the heat dissipating layer 17 is in contact with thesurface of the speaker box 15 that is distant from the antenna panel 14.A thermal correlation between the heat dissipating layer 17 and thespeaker box 15 is actually established, so that heat of the speaker box15 is transferred to the heat dissipating layer 17, to implement heatdissipation of a region of the speaker box 15. The other surface of theantenna panel 14 that is distant from the speaker box 15 is in contactwith the third region of the middle frame 16, and the antenna panel 14may be secured to the middle frame 16, so that the antenna panel 14 isstable in the electronic device. It should be noted that the heat of thespeaker box 15 includes heat generated by a heat emitting element insidethe speaker box 15, and further includes heat generated by a partadjacent to the speaker box 15, for example, the antenna panel 14.

The heat dissipation structure for an electronic device provided inEmbodiment 1 of this application may include the rear cover, themainboard, the battery, the antenna panel, the speaker box, and themiddle frame. The heat dissipating layer is disposed on the rear cover.The first shield cover and the second shield cover are disposed on themainboard. The speaker box is disposed on the surface of the antennapanel. The first region of the heat dissipating layer is in contact withthe first shield cover of the mainboard, and the second shield cover ofthe mainboard is in contact with the first region of the middle frame.The second region of the heat dissipating layer is in contact with thesurface of the battery, and the other surface of the battery that isdistant from the heat dissipating layer is in contact with the secondregion of the middle frame. The third region of the heat dissipatinglayer is in contact with the surface of the speaker box that is distantfrom the antenna panel, and the other surface of the antenna panel thatis distant from the speaker box is in contact with the third region ofthe middle frame. In the heat dissipation structure for an electronicdevice, because the heat dissipating layer disposed on the rear covermay be in contact with the mainboard and the battery, and may also be incontact with the speaker box, the heat dissipation structure for anelectronic device implements heat dissipation of the mainboard and thebattery, and may further implement heat dissipation of the region of thespeaker box, to effectively avoid local high temperature in scenariossuch as a game, a video, and music, and implement equalized heatdissipation of the electronic device, thereby improving user experience.

Optionally, the third region of the heat dissipating layer 17 is incontact with a partial or entire region of the surface of the speakerbox 15 that is distant from the antenna panel 14.

Optionally, the third region of the heat dissipating layer 17 may be incontact with the surface of the speaker box 15 that is distant from theantenna panel 14 through adhesion or welding. An adhesive used in theadhesive manner is an adhesive for heat conduction, and a flux used inthe welding manner is a thermally conductive flux.

The other surface of the antenna panel 14 that is distant from thespeaker box 15 may be in contact with the third region of the middleframe 16 by using a screw. For example, the screw may be a thermallyconductive screw.

Specifically, because the material used in the adhesion or in thewelding is a thermally conductive material, when the heat dissipatinglayer 17 is in contact with the speaker box 15 in through the adhesionor the welding, thermal conductivity between the heat dissipating layer17 and the speaker box 15 may be improved, and heat transfer efficiencymay be increased.

Optionally, the first region of the heat dissipating layer 17 may alsobe in contact with the first shield cover 18 of the mainboard 12 inthrough adhesion or welding, and the second shield cover 19 of themainboard 12 may also be in contact with the first region of the middleframe 16 through adhesion or welding. An adhesive used in the adhesionmay also be an adhesive for heat conduction, and a flux used in thewelding is a thermally conductive flux.

Specifically, because the material used in the adhesion or in thewelding is a thermally conductive material, when the heat dissipatinglayer 17 is in contact with the first shield cover 18 through theadhesion or the welding, thermal conductivity between the heatdissipating layer 17 and the first shield cover 18 may be improved,thereby improving thermal conductivity between the mainboard 12 and theheat dissipating layer, and increasing heat transfer efficiency.

Optionally, the second region of the heat dissipating layer 17 may alsobe in contact with the battery 13 through adhesion or welding, and theother surface of the battery 13 that is distant from the heatdissipating layer 17 may also be in contact with the second region ofmiddle frame 16 through adhesion or welding. An adhesive used in theadhesion may also be an adhesive for heat conduction, and a flux used inthe welding is a thermally conductive flux.

Specifically, because the material used in the adhesion or in thewelding is a thermally conductive material, when the heat dissipatinglayer 17 is in contact with the battery 13 through the adhesion or thewelding, thermal conductivity between the heat dissipating layer 17 andthe battery 13 may be improved, and heat transfer efficiency may beincreased.

Optionally, a material of the speaker box 15 is a thermally conductivematerial, and the thermally conductive material includes any one of thefollowing, including thermally conductive plastic, ceramic, metal, andthe like.

Specifically, a material of the speaker box 15 is set to a thermallyconductive material, so that heat generated by an element inside thespeaker box 15 may be better conducted to a surface of the speaker box15, for effective dissipation. It should be noted that the material ofthe speaker box 15 may alternatively be another thermally conductivematerial. The thermally conductive plastic, ceramic, and metal are onlyexamples for illustration. This application is not limited thereto.

Optionally, a dielectric constant of the thermally conductive materialis less than or equal to 8, a loss angle of the thermally conductivematerial is less than or equal to 0.01, and a thermal conductionfrequency of the thermally conductive material is greater than or equalto 1 W/(m*K). W is a heat unit watt, m is a unit meter, and K is athermodynamic temperature unit Kelvin.

Specifically, the dielectric constant of the thermally conductivematerial of the speaker box 15 is less than or equal to 8, so that heatgenerated by the element inside the speaker box 15 may be betterconducted to the surface of the speaker box 15, to effectively avoidelectrical interference from the element inside the speaker box 15. Thecoefficient of thermal conductivity of the thermally conductive materialof the speaker box 15 is greater than or equal to 1 W/(m*K), so thatheat conductivity between the element inside the speaker box 15 and thespeaker box 15 is improved, and heat transfer efficiency is increased.

Optionally, the antenna panel 14 is further disposed with a charger. Thecharger may be located inside the speaker box 15.

Specifically, heat generated by the charger in a charging process may betransferred to the speaker box 15 by using the antenna panel 14, andthen is dissipated by using the heat dissipating layer 17 in contactwith the speaker box 15. Heat dissipation of the region of the speakerbox in a charging scenario may also be implemented, to avoid local hightemperature of the electronic device, and improve user experience.

FIG. 2 is a schematic diagram of a heat dissipation structure for anelectronic device according to Embodiment 2 of this application. Asshown in FIG. 2, in the foregoing heat dissipation structure for anelectronic device, a heat dissipating layer 17 includes a heatequalizing layer 171. The heat equalizing layer 171 is in contact with amainboard 12, a battery 13, and a speaker box 15.

Specifically, a first region of the heat equalizing layer 171 of theheat dissipating layer 17 may be in contact with a first shield cover 18of the mainboard 12, and a second shield cover 19 of the mainboard 12 isin contact with a first region of a middle frame 16. A second region ofthe heat equalizing layer 171 is in contact with a surface of thebattery 13. A third region of the heat equalizing layer 171 is incontact with a surface of the speaker box 15 that is distant from anantenna panel 14.

The heat equalizing layer 171 may be formed by a thermally conductivematerial such as copper foil or graphite, and has a relatively highcoefficient of planar thermal conductivity. The heat equalizing layer171 can be configured to evenly dissipate heat absorbed from themainboard 12, the battery 13, and the speaker box 15, to effectivelyavoid local heat dissipation of an electronic device.

Optionally, the coefficient of thermal conductivity of the heatequalizing layer 171 is greater than or equal to 250 W/(m*K).

Optionally, the heat dissipating layer 17 further includes a heataccumulating layer 172 and a heat insulation layer 173. The heatinsulation layer 173 is in contact with a rear cover 11. The heataccumulating layer 172 is located between the heat insulation layer 173and the heat equalizing layer 171.

Specifically, the heat accumulating layer 172 may be formed by a phasechange material, and can absorb heat from the heat equalizing layer 171by using a phase change, and store heat energy, to alleviate temperaturerise of the rear cover 11 of the electronic device. The heat insulationlayer 173 may be formed by a heat-insulation material, and can preventheat from being directly transferred to the rear cover 11, to alleviatetemperature rise of the rear cover 11 of the electronic device. The heatequalizing layer 171, the heat accumulating layer 172, and the heatinsulation layer 173 may have different thicknesses. A thickness ratioof the heat equalizing layer 171, the heat accumulating layer 172, andthe heat insulation layer 173 may be, for example, 2:2.5:3.

To ensure electrical performance of an antenna element on the antennapanel 14, the heat equalizing layer 171 may be in contact with a partialregion of the surface of the speaker box 15 that is distant from theantenna panel 14. Coverage areas of the heat accumulating layer 172 andthe heat insulation layer 173 may be greater than that of the heatequalizing layer.

Optionally, a specific heat capacity of the heat accumulating layer 172is greater than or equal to 100 J/(g*K), and a coefficient of thermalconductivity of the heat insulation layer 173 is less than or equal to0.5 W/(m*K). J is a heat unit Joule, g is a mass unit gram, and K is athermodynamic temperature unit Kelvin.

When the specific heat capacity of the heat accumulating layer 172 isgreater than or equal to 100 J/(g*K), a heat storage capability of theheat accumulating layer 172 may be effectively ensured, to effectivelyalleviate temperature rise of the rear cover 11 of the electronicdevice. In addition, when the coefficient of thermal conductivity of theheat insulation layer 173 is less than or equal to 0.5 W/(m*K), transferof heat of the heat accumulating layer 172 to the rear cover 11 may alsobe effectively alleviated, to effectively alleviate temperature rise ofthe rear cover of the electronic device.

FIG. 3 is a schematic diagram of another heat dissipation structure foran electronic device according to Embodiment 2 of this application. Asshown in FIG. 3, in any one of the foregoing heat dissipation structuresfor an electronic device, in a direction perpendicular to the heatdissipating layer 17, the middle frame 16 is further disposed with afirst separating piece 161 and a second separating piece 162. The firstseparating piece 161 is configured to separate the mainboard 12 from thebattery 13 along a longitudinal direction, the second separating piece162 is configured to separate the battery 13 from the antenna panel 14along the longitudinal direction, and the longitudinal direction is adirection perpendicular to the heat dissipating layer 17.

Optionally, thermally conductive foam 20 is further disposed between theantenna panel 14 and the second separating piece 162.

Optionally, the heat dissipation structure for an electronic device mayfurther include a front cover. For example, the front cover may be adisplay screen of an electronic device. The front cover may be locatedon one side of the middle frame 16 that is distant from the rear cover11.

The thermally conductive foam 20 disposed between the antenna panel 14and the second separating piece 162 may implement a heat conduction pathsequentially including the battery 13, the second separating piece 162,the antenna panel 14, and the speaker box 15, to implement heatdissipation on the heat conduction path, and effectively avoid localheat generation of the electronic device.

Embodiment 3 of this application further provides an electronic device.FIG. 4 is a schematic structural diagram of the electronic deviceaccording to Embodiment 3 of this application. As shown in FIG. 4, theelectronic device 40 may include a heat dissipation structure 41. Theheat dissipation structure 41 may be any one of the heat dissipationstructures in FIG. 1 to FIG. 3.

The electronic device provided in Embodiment 3 of this application mayinclude any one of the foregoing heat dissipation structures for anelectronic device. Therefore, heat dissipation of the mainboard and thebattery inside the electronic device may be implemented, and heatdissipation of a region of the speaker box may also be implemented, toeffectively avoid local heat generation of the electronic device, andimplement equalized heat dissipation of the electronic device, therebyimproving user experience.

Finally, it should be noted that the foregoing embodiments are merelyintended for describing the technical solutions of this application, butnot for limiting this application. Although this application isdescribed in detail with reference to the foregoing embodiments, personsof ordinary skill in the art should understand that they may still makemodifications to the technical solutions described in the foregoingembodiments or make equivalent replacements to some or all technicalfeatures thereof, without departing from the scope of the technicalsolutions in the embodiments of this application.

The invention claimed is:
 1. A device, comprising: a rear cover, whereina heat dissipating layer is disposed on the rear cover; a mainboard,wherein a first shield cover and a second shield cover are disposed onthe mainboard; a battery; an antenna panel; a speaker box, wherein thespeaker box is disposed on a first surface of the antenna panel; and amiddle frame, wherein the second shield cover of the mainboard is incontact with a first region of the middle frame; wherein a first regionof the heat dissipating layer is in contact with the first shield coverof the mainboard; wherein a second region of the heat dissipating layeris in contact with a first surface of the battery, and a second surfaceof the battery that is distal to the heat dissipating layer is incontact with a second region of the middle frame; and wherein a thirdregion of the heat dissipating layer is in contact with a first surfaceof the speaker box that is distal to the antenna panel, and a secondsurface of the antenna panel that is distal to the speaker box is incontact with a third region of the middle frame.
 2. The device accordingto claim 1, wherein the third region of the heat dissipating layer is incontact with the first surface of the speaker box.
 3. The deviceaccording to claim 2, wherein the third region of the heat dissipatinglayer is adhered to the first surface of the speaker box using anadhesive for heat conduction.
 4. The device according to claim 2,wherein the third region of the heat dissipating layer welded to thefirst surface of the speaker box.
 5. The device according to claim 1,wherein a material of the speaker box is a thermally conductivematerial, and the thermally conductive material comprises thermallyconductive plastic, ceramic, or metal.
 6. The device according to claim5, wherein a dielectric constant of the thermally conductive material isless than or equal to 8, wherein a loss angle of the thermallyconductive material is less than or equal to 0.01, and wherein acoefficient of thermal conductivity of the thermally conductive materialis greater than or equal to 1 W/(m*K).
 7. The device according to claim1, wherein a charger is further disposed on the antenna panel.
 8. Thedevice according to claim 1, wherein the heat dissipating layercomprises a heat equalizing layer, and wherein the heat equalizing layeris in contact with the mainboard, the battery, and the antenna panel. 9.The device according to claim 8, wherein a coefficient of thermalconductivity of the heat equalizing layer is greater than or equal to250 W/(m*K).
 10. The device according to claim 8, wherein the heatdissipating layer further comprises a heat accumulating layer and a heatinsulation layer, wherein the heat insulation layer is in contact withthe rear cover, and wherein the heat accumulating layer is between theheat insulation layer and the heat equalizing layer.
 11. The deviceaccording to claim 10, wherein a specific heat capacity of the heataccumulating layer is greater than or equal to 100 J/(g*K), and whereina coefficient of thermal conductivity of the heat insulation layer isless than or equal to 0.5 W/(m*K).
 12. The device according to claim 1,wherein the middle frame comprises a first separating piece and a secondseparating piece, wherein the first separating piece is configured toseparate the mainboard from the battery along a longitudinal direction,wherein the second separating piece is configured to separate thebattery from the antenna panel along the longitudinal direction, andwherein the longitudinal direction is a direction perpendicular to amajor surface of the heat dissipating layer.
 13. The device according toclaim 12, wherein a thermally conductive foam is between the antennapanel and the second separating piece.